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Seonhee Jang, Ph.D.

Assistant Professor

Ph.D. Materials Science and Engineering, North Carolina State University
M.B.A. College of Business, Korea Advanced Institute of Science and Technology, Korea
M.S. Physics, Sungkyunkwan University, Korea
B.S. Physics, Sungkyunkwan University, Korea

Contact Information:

P.O. Box 43678
Lafayette, LA 70504-3636
Rougeou Hall 224
Phone: 337-482-6524


Courses Taught:

ENGR 219 - Mechanics of Materials

Areas of Research Specialization:

Dr. Jang is an assistant professor in the Department of Mechanical Engineering at the University of Louisiana at Lafayette. Dr. Jang received her PhD in Materials Science and Engineering at North Carolina State University. During her graduate study, she worked on the microstructure and mechanical properties of nanocrystalline metals and alloys. After her PhD, she worked as a principal research engineer and project leader of printed electronics research group in Samsung Electro-Mechanics (2007-2015) and as a research associate in Sungkyunkwan University (2015-2017). Her research focuses on semiconductor processing, thin film growth, nanomaterials synthesis and process, materials characterization, and flexible/printed electronics.

Areas of Research Interest:

  • Growth and characterization of functional thin films using plasma enhanced chemical vapor deposition of organic/inorganic precursors: ceramic thin films for passivation or encapsulation layers in organic electronics, low-k dielectric films for flexible electronics, hard mask layers used for ultra-fine patterned semiconductor devices, and chemically modified polymerized thin films for biocompatibility applied to biochips/biosensors
  • Development of printing technologies with various printing methods (inkjet/screen/gravure) and sintering processes (thermal/photonic/laser/microwave/plasma) for electrodes and interconnects used in flexible electronic devices including thin film transistors, flex circuits, RFIDs, sensors, solar cells, light emitting diodes, printed circuit boards, and integrated circuit packaging